Hi2115芯片 的封装为VFBGA 5.8*5.8, SE模块的封装是QFN 4*4, 考虑到SIM卡和引脚的尺寸。
芯片特性： 1 Supports 3GPP bands in the ranges 698-960 MHz and 1695-2180 MHz 2 Supports 3GPP NB-IoT air interfaces and protocols [1] 3 Provides 20 dB extended coverage compared to GPRS (so 164 dB 4 Maximum Coupling Loss, equivalent to a 179 dB link budget) 5 Integrated radio transceiver, protocol processor and NB-IoT stack 6 supporting QPSK for OFDM downlink and BPSK/QPSK for SC-FDMA uplink (single-tone and multi-tone) 7 Fully compliant with FCC regulations for transmit spectral mask and out-of-band emissions 8 Dedicated Application Processor with on-chip memory (256kB Flash and 64kB RAM) 9 Integrated application peripherals including temperature sensor, capacitive touch sensor, ADCs, DACs, 10 programmable current source and interrupt comparators 11 Ultra-Low Power Standby mode 12 Integrated Power Management Unit for Direct-from-Battery operation 13 Supports ESD HM2000V/Class 2
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发表于 2018-6-4 16:31:42
发表于 2018-7-11 15:34:51
