To achieve MT6750 platform performance, we suggest you refer to
MediaTek’s thermal strategy for thermal solution design.
▪ For slim phone design (phone thickness < 10mm), the hot spot on the phone surface is obvious. Apply heat spreader material on the back cover or mid-frame to make thermal mitigation for uniform temperature distribution. ▪ The package type of MT6750 is FCBGA. Planning heat transfer on top of the package is a very important thermal strategy. • Solution 1: Add Thermal Interface Material between the top of package and shielding case. • Solution 2: Use metal-frame for phone structure design. • Solution 3: Make sure AP and metal-frame are in the same side. ▪ PCB size is a key factor for thermal performance. PCB size > 3,000mm2
▪ If the material of mid-frame is stainless, attach copper foil on the
stainless side to improve in-plan thermal performance.