Contents
- Thermal Consideration
- PCB layout
- PCB Stack-up
- PCB Placement
- Shielding
- Mechanical Structure
- MT8167 Thermal strategy
- MT8167 Platform Thermal Requirement-BTS
- Thermal consideration on Charger
- Thermal Simulation Reference
Thermal Consideration on PCB Layout
- MT8167 PCB layout consideration
- MT8167 PWR/GND balls are in the center of package, and that is the main heat path for conducting heat from PKG to PCB.
- Proper PCB layout can help heat distributed into PCB effectively and improve PKG thermal performance.
- GND via design is the key factor to enhancing heat conduction and especially complex in PCB design
- MT8167 reference PCB Layout (4 Layer).
MT8167
Thermal Consideration on PCB Stack - up
- PCB stack - up thermal consideration
- To make the PCB design can create maximum PCB thermal be NEFit, a corresponding high copper coverage in layers where GND Via is connected is required.
- From thermal perspective, we suggest to grasp every chance to maintain high metal coverage in the PCB layer whenever it is feasible. GND plane is usually high metal coverage layers and therefore is deemed as the major path for heat to spread outwards.
- To meet PCB PI/SI stack - up requirements, we strongly suggest you place more than one GND plane in a short PCB application, which is often a high multi
- MT8167 reference PCB Layout (4 Layer).
MT8167
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- MT8167 Thermal Design Notice
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