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[SMT原创资料] SMT Application Notes for aQFN (AQFN封装SMT说明书)

发表于 2017-11-28 11:11:10 | 显示全部楼层 |阅读模式 来自 广东省深圳市
SMT Application Notes for aQFN (AQFN封装SMT说明书)

SMT Application Notes for aQFN

SMT Application Notes for aQFN

目录

MediaTek Confidential © 2011 MediaTek Inc. Page 2 of 28
This document contains information that is proprietary to MediaTek Inc.
Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.
Table of Contents 索引..................................................................................................................................................... 2
Document Revision History 文件版本沿革 ..................................................................................................................... 4
1 Introduction 简介 ..................................................................................................................................................... 5
2 Design Data 设计说明 .............................................................................................................................................. 6
2.1 PCB design recommendation 印刷电路板设计建议 ....................................................................................... 6
2.1.1 Min. trace width/space recommendation 最小线宽/距建议 .......................................................... 6
2.1.2 Via design recommendation 钻孔设计建议.................................................................................. 6
2.1.2.1 Via size recommendation 钻孔尺寸建议................................................................................. 6
2.1.2.2 Placement of blind via under chip recommendation 芯片下方的盲孔布局建议...................... 6
2.1.2.3 Placement of thru-via under chip recommendation 芯片下方的通孔布局建议......................... 7
2.1.3 Solder mask design recommendation 防焊绿油设计建议............................................................ 7
2.1.4 Top layer routing under aQFN recommendation aQFN 下方表层设计建议 ................................... 8
2.1.4.1 Chip fan-out recommendation 芯片下方的出线建议............................................................... 8
2.1.4.2 Forbid making copper plane on the surface layer under aQFN 禁止在 aQFN 下方表层铺铜 8
2.2 Center pad stencil design recommendation 中央焊盘鋼網设计建议............................................................. 9
2.3 MT6253........................................................................................................................................................... 10
2.3.1 Package outline drawing 产品外观尺寸图.................................................................................. 10
2.3.2 PCB pad design recommendation 印刷电路板焊盘设计建议...................................................... 11
2.3.2.1 HDI PCB HDI 印刷电路板................................................................................................... 11
2.3.2.2 THV PCB 通孔印刷电路板.................................................................................................. 12
2.3.3 Stencil design recommendation 钢网设计建议 ........................................................................... 14
2.3.3.1 HDI stencil design recommendation HDI 板钢网设计建议 ................................................. 14
2.3.3.2 THV stencil design recommendation 通孔板钢网设计建议 ............................................... 15
2.4 MT6162........................................................................................................................................................... 16
2.4.1 Package outline drawing 产品外观尺寸图.................................................................................. 16
2.4.2 PCB pad design recommendation 印刷电路板焊盘设计建议...................................................... 17
2.4.3 Stencil design recommendation 钢网设计建议 ........................................................................... 18
2.5 MT6326........................................................................................................................................................... 19
2.5.1 Package outline drawing 产品外观尺寸图.................................................................................. 19
2.5.2 PCB pad design recommendation 印刷电路板焊盘设计建议...................................................... 20
2.5.3 Stencil design recommendation 钢网设计建议 ........................................................................... 21
2.6 MT6163........................................................................................................................................................... 22
2.6.1 Package outline drawing 产品外观尺寸图.................................................................................. 22
2.6.2 PCB pad design recommendation 印刷电路板焊盘设计建议...................................................... 23
2.6.3 Stencil design recommendation 钢网设计建议 ........................................................................... 24
3 SMT Verification 贴片工艺确认.............................................................................................................................. 25
3.1 SMT reflow profile 贴片工艺回焊曲线......................................................................................................... 25
3.2 SMT verification 贴片制程验证 ..................................................................................................................... 26


SMT Application Notes for aQFN目录

SMT Application Notes for aQFN目录




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发表于 2019-5-15 15:19:16 | 显示全部楼层 来自 广东省深圳市
谢谢楼主的分享
发表于 2020-2-24 14:21:33 | 显示全部楼层 来自 河北省

_

谢谢,分享啊
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发表于 2021-7-2 20:30:33 | 显示全部楼层 来自 广东省深圳市
谢谢分享
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发表于 2021-7-2 20:35:04 | 显示全部楼层 来自 广东省深圳市
不是四周脚的QFN
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