Since smart phone design is going to be lighter, thinner and with larger Battery capacity, its PCB design will be more complicated in order to satisfy good performance of the Power Delivery Network (PDN), high-frequency CPU and mobile memory.
In order to help customer to design “Correct”, “Excellent” and “Reliable” smart phone PCB, the slide introduce MediaTek Module Design (MMD), and provide methods to implement module designs of PDN & eMCP. The purposes of MMD are helping customer to reduce time of PCB design, ensure stable system performance as well as significantly reduce test
and debug efforts.