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IR0603C特点与优势:
●封装: SMT封装0603(1.6*0.8*0.7mm)
● 芯片材料:IR:A LGAAs/Si
●波长:IR:940nm
●光功率等级:IR:2mW/sr@20mA
●发光面外观:水清
●焊接方式:IR Reflow
绝对最大额定值(Ta=25°C)
Parameter | Symbol | Rating | Unit | power DisSIPation | Pd | 75 | mW | Forward current | IF | 50 | mA | Peak Forward Current | IFP | 100 | mA | Reverse Voltage | VR | 5 | V | Soldering Temperature | Tsol | Reflow soldering (260°C for 10 sec.)
Hand soldering(300°C for 3sec) | °C | Operating Temperature | Topr | -30°C ~ +85°C | - | Storage Temperature | Tstg | -40°C ~+100°C | - |
电光特性(Ta=25°C)
Parameter | Symbol | Min. | Typ- | Max. | Unit | Condition | RADIant Intensity | Ie | 1.5 | 2 | - | mW/sr | IF=20mA | Forward Voltage | Vf | | 1.3 | 1.5 | V | Peak Wavelength | λP | | 940 | - | nm | SPECtral Bandwidth | Δλ | | 30 | - | nm | Reverse Current | Ir | | - | 10 | ma | Vr=5V | View Angle | 2θ1/2 | | 130 | - | deg | lF=20mA |
封装外形尺寸
典型的光电特性曲线
更多详细内容请下载附件查看
IR0603C Series 940nm Datasheet - A1.pdf
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