已绑定手机
|
特点与优势
●封装: SMT封装0603(1.6*0.8*0.98mm)
● 芯片材料:R:A LGAInP/Si
●波长:R:660nm
●光功率等级:R:800mcd@20mA
●发光面外观:Water Clear
●焊接方式:R Reflow
封装尺寸图
典型应用:红外应用系统
1. 绝对最大额定值(Ta=25°C)
Parameter | Symbol | Rating | Unit | power DisSIPation | Pd | 70 | mW | Forward current | If | 30 | mA | Peak Forward Current | Ifp | 100 | mA | Reverse Voltage | VR | 5 | V | Soldering Temperature | Tsol | Reflow soldering (260°C for 10 sec.)
Hand soldering(300°C for 3sec) | °C | Operating Temperature | Topr | -30°C ~ +85°C | - | Storage Temperature | Tstg | -40°C ~+100°C | - | | | | |
2. 电光特性(Ta=25°C)
Parameter | Symbol | Min. | Typ | Max. | Unit | Condition | Luminous Intensity | IV | 500 | 800 | - | med | IF=20mA | RADIant Intensity | IE | 8 | 14 | | mW/sr | Forward Voltage | Vf | | 2.1 | 2.3 | V | Peak Wavelength | λP | | 660 | - | nm | SPECtral Bandwidth | Δλ | | 30 | - | nm | Reverse Current | Ir | | - | 10 | μA | Vr=5V | View Angle | 2θ1/2 | | 55 | - | deg | lF=20mA |
更多详细内容请下载附件查看
R0603L Series Datasheet - A1 - 660nm.pdf
(873.48 KB, 下载次数: 0)
|
|