SL3414是N沟道逻辑增强模式功率场效应
晶体管,采用高单元密度先进沟槽技术生产。这种高密度工艺专门用于最大限度地降低通态电阻。这些器件特别适用于低电压应用,并且在外形非常小的表面贴装封装中需要低在线功率损耗。
特征
●20V/6A, RDS(ON)=20mΩ (typ.)@VGS=4.5V
●20V/5A, RDS(ON)=24mΩ (typ.)@VGS=2.5V
●20V/4A, RDS(ON)=30mΩ (typ.)@VGS=1 .8V
●超高设计,极低 RDS(ON)
●卓越的导通电阻和最大直流电流能力
●完全符合RoHS
●SOT23-3L封装设计
应用
●笔记本
电源管理
●便携式设备
●电池供电系统
引脚配置
绝对最大额定值(TA = 25℃ 除非另有说明)
Symbol | Parameter | Typical | Unit |
Vdss | Drain-Source Voltage | 20 | V |
Vgss | Gate-Source Voltage | ±12 | V |
ID | Continuous Drain current (TJ=150°C) | VGS-4.5V | 6 | A |
IDM | PulSED Drain Current | 20 | A |
Is | Continuous Source Current (Diode Conduction) | 1 | A |
Pd | power DisSIPation | TA=25°C | 1.25(SOT23-3L) | W |
TA=75°C | 0.8(SOT23-3L) |
Tj | Operation Junction Temperature | 150 | °C |
Tstg | Storage Temperature Range | -55~+150 | °C |
电气特性(
VDD=2.75V, TA=25℃ 除非另有说明)
Symbol | Parameter | Condition | Min | Typ | Max | Unit |
Static Parameters |
V(BR)DSS | Drain-Source Breakdown Voltage | VGS=0V, ID=250uA | 20 | | | V |
VGS(th) | Gate Threshold Voltage | VDS=VGS, ID=250uA | 0.5 | | 1 | V |
IGSS | Gate Leakage Current | VDS=0V, VGS=±12V | | | ±100 | nA |
IDSS | Zero Gate Voltage Drain Current | VDS=16V, VGS=0 | | | 1 | |
VDS=16V, VGS=0 TJ=85℃ | | | 30 | uA |
ID(ON) | On=State Drain Current | VDS≧5V, VGS=4.5V | 4 | | | A |
RDS(ON) | Drain-Source On-Resistance | VGS=4.5V, ID=6A | | 20 | 30 | mΩ |
VGS=2.5V, ID=5A | | 24 | 35 |
VGS=1.8V, ID=4A | | 30 | 40 |
Gfs | Forward Transconductance | VDS=5V, ID=3.6A | | 10 | | S |
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