| T820 | 1*A76 2.7GHz+3*A76 2.3GHz+4*A55 2.1GHz |
| GPU Natt 4C,ES3.0 60fps@850MHz |
| FHD+120fps,64M30fps/108M(9 in 1) |
| VDSP + NPU (8 TOPS),TSMC 6nm |
| T770 | 1*A76 2.5GHz+3*A76 2.2GHz+4xA55 2.0GHz |
| GPU Natt 4C,ES3.0 55fps FHD+120fps,64M |
| 30fps/108M(9 in 1) |
| VDSP+NPU (4.8 TOPS),TSMC 6nm |
| T760 | 4*A762.2GHz+4*A552.0GHz |
| GPU Natt 4C,ES3.0 46fps |
| FHD+120fps,48M30fps/64M |
| VDSP+NPU (3.2TOPS),TSMC 6nm |
1 系统概述
1.1 概述
UMS9620 是一款集成了 2G/3G/4G/5G
调制解调器的高性能应用处理器。
它由四个高性能内核 Ar
m® Cortex®-A76 高达 2.2GHz 和 4 核 Arm® Cortex®-A55 高达 2.0GHz 组成。此外，还包括一组广泛的接口，用于连接相机、触摸屏显示器和 UFS/eMMC/SD 卡。
配备 Arm® NeonTM 引擎的应用处理器支持最新的 Open OS 及其要求苛刻的应用程序，例如网页浏览、电子邮件和游戏。还集成了多标准多媒体加速器和高级音频子系统，以提供高级多媒体应用和服务，例如流式音频和视频。
高性能 CPU 和硬件加速器相结合，提供能够支持 NR FR1、LTE UL Cat18 和 DL Cat15、Cat24
HSDPA 和 Cat7 HSUPA 数据速率、Cat15 TD-HSDPA 和 Cat6 TD-HSUPA、Class12
GPRS/EDGE 的调制解调器子系统。
UMS9620经过特别优化的架构可以为很多应用实现高性能和低功耗。为低功耗 ASIC 设计和电源管理开发了专有架构和算法。独特的技术用于噪声抑制/消除、回声抑制/消除算法。总体而言，UMS9620
芯片组为 5G
Android 移动设备提供了一个高效能平台。
1.2 功能框图
下图为UMS9620的芯片级功能框图。
图 1-1 UMS9620 功能框图
图 1-1 UMS9620 功能框图
1.3 突出特点
- 6nm EUV 工艺打造一流的低功耗 5G SOC 芯片
- 四核Arm®Cortex®-A76最高2.2GHz
- 四核Arm®Cortex®-A55最高2.0GHz
- 共享 3MB 三级缓存
- Arm® MaliTM-G57 4核，最高650MHz
- IMG AX3596 高达 307.2MHz
- 支持LPDDR4x，时钟高达2133MHz
- 支持UFS3.1
- 支持带间/带内2CC 100M+30M
- FDD：DL Cat15 + UL Cat13,800Mbps DL/ 150Mbps UL(LTE only)
- TDD：DL Cat15 + UL Cat18（仅限LTE）
- FDD/TDD：DL Cat15、UL Cat18(EN-DC)
- 支持FHD+@90fps
1.4 特点
1.4.1 平台特点
接入点子系统
- 四核 Arm Cortex-A76 高达 2.2GHz，具有 64KB L1 I-cache、64KB L1 D-cache 和 256KB L2 cache
- 四核 Arm Cortex-A55 最高 2.0GHz，每个内核具有 32KB L1 I-cache、32KB L1 D-cache 和 128KB二级缓存
- 共享 3MB 三级缓存
- Arm NeonTM 多媒体处理引擎与 SIMDv2/VFPv4 ISA
- DVFS技术，工作电压0.65V~0.95V
NPU子系统
- IMG AX3596 高达 307.2MHz
- 支持一系列神经网络操作，如卷积、激活、元素操作、池化等等
- 无损权重数据压缩
- 多主机的DRM安全和调度
VDSP子系统
- VQ7 高达 1014MHz，256KB 数据 RAM
安全子系统
外部存储器接口
- 支持eMMC 5.1 HS400
- 支持LPDDR4x
- 支持UFS3.1 支持以下内存组合：
−
eMCP(eMMC/LPDDR4x)
− eMMC + LPDDR4x
− uMCP(UFS3.1/LPDDR4x)
− UFS3.1 + LPDDR4x
- eMMC 闪存由 eMMC 控制器支持，具有以下特性：
− 支持1.8V I/O
− 支持 1.8 或 3.0V VCC
− 支持 1/4/8 位设备
1 系统概述 ................................................... ..................................................... ............................................................1
1.1 概述................................................................ ..................................................... ................................................... 1
1.2 功能框图.................................................................. ..................................................... ........................................... 1
1.3 突出特点................................................................ ..................................................... ............................................. 2
1.4 特点 ................................................... ..................................................... ..................................................... ......... 3
1.4.1 平台特点 ................................................... ..................................................... ...................................................... 3
1.4.2 调制解调器特性.......................... ..................................................... ...................................................................... 4
1.4.3 多媒体功能.......................... ..................................................... ............................................................................. 6
1.4.4 封装.................................................................. ..................................................... ............................................... 9
2 零件标记 .................................. ..................................................... .............................................................................10
2.1 包装信息.................................................................. ..................................................... .......................................... 10
2.2 顶部标记定义.................................................................. ..................................................... .................................... 10
2.3 封装外形................................................................ ..................................................... ..............................................11
2.4 回流曲线 ................................................... ..................................................... ..................................................... ... 13
2.5 设备湿度敏感度等级 ................................................... ..................................................... ......................................... 13
2.6 热特性.................................................................. ..................................................... ............................................... 14
3 引脚定义.................................................................. ..................................................... ................................................15
3.1 BGA 引脚排列 ................................... ..................................................... ..................................................... ............. 15
3.2 管脚符号说明.......................... ..................................................... ............................................................................... 15
3.3 管脚列表 ................................... ..................................................... ..................................................... ..................... 18
3.4 引脚说明 ................................................... ..................................................... ....................................................... .... 18
3.5 引脚复用功能列表.................................................................. ..................................................... ................................... 41
3.6 引脚状态和 GPIO ............................................. ..................................................... ....................................................... 65
3.7 引脚寄存器说明 ................................................... ..................................................... .................................................... 72
3.8 捆扎销.................................................................. ..................................................... ............................................ ...... 72
3.9 焊盘信息 ................................................... ..................................................... .......................................................... ... 72
3.9.1 SPSCBC2_8X_VL/HL................................................. ..................................................... ................................................... 73
3.9.2 SPSCBC2_8X_SR_VL/HL.................................................................. ..................................................... ............................. 74
3.9.3 SPSCBC2_8X_W_VL/HL................................................................. ..................................................... ................................76
3.9.4 SPSEBC2_24X_VL/HL.................................................. ..................................................... ..................................................78
3.9.5 PDWUWSWCDGSDE_V/H................................................................. ..................................................... ............................. 80
3.9.6 SPSEBC2_SWP_HL/VL................................................................. ..................................................... ................................. 81
4 电气规格 ................................................... ..................................................... .......................................................................89
4.1 直流规格 .................................................... ..................................................... ................................................................. . 89
4.1.1 绝对最大额定值.......................... ..................................................... ................................................................................. 89
4.1.2 推荐的工作条件.......................... ..................................................... ................................................................................... 89
4.1.3 ESD 特性.......................... ..................................................... ............................................................................................. 91
4.1.4 直流特性 ................................................... ..................................................... .................................................................... 91
4.2 交流特性.................................................................. ..................................................... ........................................................ 94
4.3 性能规格................................................................ ..................................................... .......................................................... 96
4.3.1 LVDSRF.................................................. ..................................................... ..................................................... .................. 96
4.3.2 SOC 锁相环 (PLL) .................................................... ..................................................... ....................................................... 97
4.3.3 热敏传感器................................................................ ..................................................... ...................................................... 98
4.3.4 USB 2.0 物理层 ................................... ..................................................... ........................................................................ .. 98
4.3.5 USB3.1/DP ComboPHY ................................... ..................................................... ................................................................. 99
4.3.6 MIPI CSI .................................... ..................................................... ............................................................................. …… 104
4.3.7 MIPI C-PHY CSI ...................................... ..................................................... ....................................................................... 104
4.3.8 MIPI DSI.................................................. ..................................................... ..................................................... ...........…… 105
4.3.9 MIPI MPHY4.1.................................................. ..................................................... ............................................................... 107
4.3.10 PCIEGEN3 ................................... ..................................................... ................................................................................. 109
4.3.11 自动功率控制 DAC.................................................. ..................................................... ....................................................... 111
4.3.12 CLK26M 缓冲器 ................................... ..................................................... .......................................................................... 112
4.3.13 RCO.................................................. ..................................................... ........................................................................ ... 112
4.3.14 数据中心 ................................... ......................... ………………………………………………………………………………………….................….113
更多内容可下载附件查看。。。
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发表于 2022-8-29 14:46
