产品列表
Capacity | Part ID | | User
Density | Power System | Pin
Configuration | Package size | 32GB | KASH6311 | 256Gb x 1 | 90% | - Interface power :
VCCQ(1.70V~1.95
V or 2.7V ~ 3.6V)
- Memory power:
VCC(2.7-3.6V) | 153FBGA | 11.5mm * 13mm * 1.0mm | 64GB | KASJ7311 | 512Gb x1 | 90% | 128GB | KASJ8311 | 512Gb x2 | 90% |
KOWIN eMMC 是一款采用 BGA 封装形式设计的嵌入式 MMC 解决方案,是一种结合了功能型闪存控制器和 NAND 闪存的高度集成解决方案。 其高性能和低功耗使 KOWIN eMMC 成为嵌入式和便携式应用的绝佳解决方案。
KOWIN eMMC 利用行业领先的技术和 NAND 管理经验。 此外,KOWIN eMMC支持标准的eMMC接口以及新引入的eMMC特性,如HS400模式和FFU。 通过集成所有先进技术,KOWIN eMMC 能够进一步提高数据传输效率并优化嵌入式系统的整体性能。
KOWIN eMMC 提供各种密度,为移动手持设备、导航、多功能打印机和下一代消费应用提供恰到好处的特性、性能和灵活性。
主要特点
• 工业标准接口:符合 JEDEC / eMMC 标准版本 5.1
• eMMC 5.1 增强功能
- 11 线总线(时钟、数据选通、1 位命令、8 位数据总线)和硬件复位
- 可编程总线宽度:1 位、4 位和 8 位
- 支持高达 400MB/s 数据速率的 HS400 高速接口定时模式
- 高达 200MHz 的时钟频率
- 支持 eMMC Field 固件更新 (FFU)
- 支持 eMMC 生产状态感知 (PSA)
- 支持 eMMC 设备健康报告
- 高速、双数据速率引导支持
- 支持启动和替代启动模式
- 重放保护内存块 (RPMB)
- 修剪、消毒、丢弃、安全擦除、安全修剪
- 增强的分区属性
- 高优先级中断 (HPI)
- 后台操作
- 增强的可靠写入
- 支持命令队列
- 支持 HS400 模式下的增强频闪
- 支持eMMC后台运行控制
• 强大的数据保护和耐用性
- 具有零开销 pSipeline 的可配置 BCH ECC 引擎大大降低了数据丢失率并提高了数据耐久性
- 具有永久、临时和开机保护选项的增强型写保护
- 读干扰保护技术确保数据可靠性
- 突然断电保护和嵌入式电压检测支持掉电数据保护
- 全局磨损均衡以最小的磨损均衡和写入放大开销最大化产品寿命
• 电源电压
- eMMC 接口电源 (VCCQ):1.70-1.95V 或 2.7-3.6V 1)
- NAND内存电源(VCC) : 2.7-3.6V
- 动态电源管理技术支持多种省电模式
• 多种密度和包装
- 有 32GB、64GB、128GB 可供选择
- 153 球标准 BGA 封装
- 绿色封装和符合 RoHS 标准
• 温度:工作时(-25°C ~ +85°C),不工作时存储(-40°C ~ 85°C)
[注] 1) VCCQ 为2.73.6V 时不支持HS200 和HS400 模式。
eMMC 新功能列表
No | Function | e•MMC | Implement (KOWIN) | Remark (eMMC Ver) | 1 | Boot | Mandatory | Yes |
| 2 | RPMB | Mandatory | Yes |
| 3 | Write Protection(including Perm & Temp) | Mandatory | Yes |
| 4 | 1.2 V I/O | Optional | No |
| 5 | Dual Data Rate timing | Optional | Yes |
| 6 | HS200 | Optional | Yes |
| 7 | Multi Partitioning | Mandatory | Yes |
| 8 | Secure Erase/Secure Trim | Optional | Yes |
| 9 | Trim | Mandatory | Yes |
| 10 | High Priority Interrupt | Mandatory | Yes |
| 11 | Background Operation | Mandatory | Yes |
| 12 | Enhance Reliable Write | Mandatory | Yes |
| 13 | Discard Command | Mandatory | Yes |
| 14 | Security Features | Mandatory | Yes |
| 15 | Partition types | Mandatory | Yes |
| 16 | Context ID | Mandatory | Yes |
| 17 | Data Tag | Mandatory | Yes |
| 18 | Packed commands | Mandatory | Yes |
| 19 | Real Time Clock | Mandatory | Yes |
| 20 | Dynamic Device Capacity | Mandatory | Yes |
| 21 | Power Off Notification | Mandatory | Yes |
| 22 | Thermal Spec | Mandatory | Yes |
| 23 | Minimum Sector Size = 4 KB (≤256 GB) | Optional | Yes |
| 24 | Minimum Sector Size = 4 KB (>256 GB) | Mandatory | Yes |
| 25 | Cache | Optional | Yes |
| 26 | Extended Security Protocols | Optional | No |
| 27 | HS400 | Optional | Yes |
| 28 | | Optional | Yes |
| 29 | | Optional | Yes |
| 30 | | Optional | Yes |
| 31 | Device Health Report | Optional | Yes |
| 32 | Command Queuing | Optional | Yes | Ver. 5.1 | 33 | Enhanced Strobe | Optional | Yes | Ver.5.1 | 34 | Cache Flushing Report | Mandatory | Yes | Ver. 5.1 | 35 | BKOPS Control | Mandatory | Yes | Ver. 5.1 | 36 | Cache Barrier | Optional | Yes | Ver. 5.1 | 37 | RPMB Throughput Improve | Optional | Yes | Ver. 5.1 | 38 | Secure Write Protection | Optional | Yes | Ver. 5.1 |
封装配置
153 球销结构
153 球销结构
信号说明(功能信号)
Signal | Type | Description | CLK | Input | Clock.
Each cycle of the clock directs a transfer on the command line and on the data line(s). The frequency can vary between the minimum and the maximum clock frequency. | RCLK | Output | eMMC interface data strobe (HS400 mode) | CMD | I/O | Command.
This signal is a bidirectional command channel used for command and response transfers. The CMD signal has two bus modes: open-drain mode and push-pull mode. Commands are sent from the MMC host to the device, and responses are sent from
the device to the host. | DAT0 – DAT7 | I/O | Data I/O.
These are bidirectional data signals. The DAT signals operate in push-pull mode. By default, after power-up or Assertion of the RST_n signal, only DAT0 is used for data transfer. The MMC controller can configure a wider data bus for data transfer using either DAT[3:0] (4-bit mode) or DAT[7:0] (8-bit mode).
eMMC includes internal pull-up resistors for data lines DAT[7:1]. Immediately after entering the 4-bit mode, the device disconnects the internal pull-up resistors on the DAT[3:1] lines. Correspondingly, immediately after entering the 8-bit mode, the device disconnects the internal pull-ups on the DAT[7:1] lines. | RST_n | Input | Reset.
The RST_n signal is used for host resetting device, moving the device to pre-idle state. By default, the RST_n signal is temporary disabled in device. The host must set bits[1:0] in the extended CSD register [162] to 0x1 to enable this functionality before
the host can use it. | VCC | Supply | NAND interface I/O and NAND Flash power supply. | VCCQ | Supply | eMMC controller core and eMMC interface I/O power supply. | GND | Supply | NAND interface I/O and NAND Flash ground connection.
eMMC controller core and eMMC interface ground connection. | VDDi | - | Internal voltage node
A 1.0uF capacitor is required for VDDi for core power stabilization. Do not tie to supply voltage or ground. |
11.5mm * 13mm * 1.0mm 封装尺寸
11.5mm x 13mm x 1.0mm 封装尺寸
Symbol | MIN | NOM | MAX | Symbol | MIN | NOM | MAX | 笔记:
1. 控制尺寸:毫米。
2. 主基准 c 和底座平面由焊球的球冠定义。
3. 尺寸 b 是在最大焊球直径处测量的,平行于主基准 C。
4.特殊性C类:bbb、ddd。
5. Pin 1基准图形仅供参考。 | A | 0.81 | 0.93 | 1.00 | TD | 0.25 | 0.30 | 0.35 | A1 | 0.15 | 0.22 | --- | TE | 0.25 | 0.30 | 0.35 | A2 | 0.66 | 0.71 | 0.76 | D1 | --- | 6.50 | --- | b | 0.25 | 0.30 | 0.35 | E1 | --- | 6.50 | --- | D | 12.90 | 13.00 | 13.10 | SD | --- | 3.25 | --- | E | 11.40 | 11.50 | 11.60 | SE | --- | 3.25 | --- | e | --- | 0.50 | --- |
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eMMC 框图
eMMC 框图
KOWIN KASH6311/KASJ7311/KASJ8311 eMMC(32GB/64GB/128GB) 产品datasheet
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