| Feature | SM7450 capability |
Processors |
| Applications | Kryo CPU built on Arm Cortex technology
■ Kryo Prime: One high performance core up to 2.4 GHz
■ Kryo Gold: Three high performance cores up to 2.36 GHz
■ Kryo Silver: Four low-power cores up to 1.8 GHz |
| Digital signal processing and artificial intelligence | Compute Hexagon DSP with dual HVX and Hexagon Co-processor (Hexagon CP) 2.0 and Hexagon Tensor Accelerator
■ Used for video playback enhancements, virtual reality, computer vision, camera snapshot enhancements, video capture enhancement, machine learning, and so on
■ The Hexagon CP is a vision and imaging hardware accelerator to offload and accelerate the Hexagon software algorithmic functions |
| Always-on system | Always-on subsystem with always-on processor
Hardware-based resource and power management (RPMh) with hardware accelerators for voltage control and regulation, clock management, and resource communication |
| Low power island (LPI) | LPI with Hexagon DSP consists of Snapdragon sensor core and lowpower audio subsystem |
| Modem | 2G/3G/4G/5G – mmWave and sub-6 GHz bands (Rel. 16) |
| Qualcomm® Location™ | Gen 9 VT v5 |
Memory support |
| System memory via non- PoP and EBI | ■ Dual-channel non-PoP high-speed memory – LPDDR4X SDRAM designed for a 2133 MHz (2 × 16-bit) clock
■ LPDDR5 3200 MHz (2 × 16-bit) clock |
| External memory | UFS3.1 G4 (2-lane)
SD v3.0 4 bit for SD card 172 KB IMEM
1.5 MB GMEM for graphics |
| Via UFS |
| Via SDC |
| Other internal memory |
RF support |
| RF operating bands | Defined by the RF transceiver SDR735 device |
Air interfaces |
| 5G NR | Yes, Rel. 16 |
| LTE | Yes, Rel.16 LTE multimode modem |
| CDMA, WCDMA, and GSM | Yes |
| WLAN/Bluetooth | Yes with WCN6750/WCN6856 |
| Antenna sharing | Antenna shared between Wi-Fi and WAN |
| GNSS – Integrated Qualcomm® Location Suite engine | Gen 9VT; GPS, GLONASS, NavIC, BeiDou, Galileo, QZSS, and SBAS |
Multimedia |
| Display support | DPU:
■ Maximum resolution for internal panel: FHD+ 144 fps
■ 2x DSI DPHY (4-lane); DSI D-PHY 1.2 or C-PHY 1.1; VESA DSC 1.2
■ 4K60 DP1.4 (USB3 + DisplayPort concurrency) |
| Camera support | Qualcomm Spectra: 84 MP at 30 fps/3 × 25 MP 30 fps ZSL
Qualcomm Spectra ISP supports connectivity to multiple cameras due to five C-PHY/D-PHY interfaces.
■ Real-time sensor input resolution: 25 + 25 + 25
■ Three IFE + two IFE lite, up to eight sensors, five concurrent MIPI CSI configurable in 4 + 4 + 4 + 4 + 4 configuration
■ 5x D-PHY v1.2 /C-PHY v1.2 |
| Video processing unit (VPU) | VPU – fifth-generation UHD video processing unit
■ Video decode: Up to 4K30 for H.264/H.265/VP9
■ Video encode: Up to 4K30 for H.264/H.265
■ Video concurrency: 1080p60 decode and 1080p60 encode/ 4K30 decode + 1080p30 encode
■ HDR playback: Support for HDR10 and HDR10+
■ HFR capture: 720p at 240 fps or 1080p at 120 fps |
| Adreno graphic processing unit (GPU) | Adreno GPU
OpenGL ES 3.2, Vulkan 1.x OpenCL 2.0, DX FL12 |
Audio
(Low power audio subsystem)
Codec
Speaker amplifier | LPI, improved voice UI concurrencies, ML hardware accelerator; V66M, LPI shared with Sensor SS
■ eNPU/AI accelerator: Embedded AI accelerator for LPI and low power use cases
■ Hardware adaptive filter enabled voice UI always by offloading echo cancellation processing
■ Hardware resampler
■ DSP offload for audio playback, including USB digital audio and Bluetooth audio WCD937x/WCD938x high fidelity audio codec
WSA883x class-H, low noise smart amplifier |
| Audio interfaces | ■ SLIMbus for WCN6750 and WCN6856
■ SoundWire interface (two Tx and two Rx data for codec)
■ SoundWire MIC support
■ Dedicated SoundWire interface for smart speaker amplifier
■ Four DMIC ports in LPI
■ Five MI2S with 2x data lanes to support full duplex stereo, or up to four channel Tx/Rx application
■ One MI2S supports four data lanes for up to eight channels Tx/Rx application |
Connectivity |
| Qualcomm universal peripheral (QUP) ports | 22: Multiplexed serial interface functions |
| USB | One USB 3.1 port: Gen 2, 10 Gbps (DisplayPort + data), support Type-C with DisplayPort v1.4 |
| PCIe | PCIe Gen 3 1-lane |
| Secure digital interfaces | ■ SDC2 (SD3.0)
■ SDC2 is dual-voltage
■ SD card; UFS |
| Touchscreen support | Capacitive panels via ext IC (I2C, SPI) |
Configurable GPIOs |
| Number of GPIO ports | 170 |
| Input configurations | Pull-up, pull-down, keeper, or no pull |
| Output configurations | Programmable drive current |
| Top-level mode multiplexer | Provides a convenient way to program groups of GPIOs |
Internal functions |
Security Crypto
QFPROM
Access control Secure boot and tools User data encryption Storage security TrustZone
DRM
QTEE services | AES-GCM, hardware ECC and RSA (Elliptic-Curve Cryptography), ICE Crypto engine v5 (CE5), FIPS/CAVP certifiable
Fuse bits available for OEM use
Programmable security domain protection and sand-boxing Secure Boot with Sec tools 2.0; easy to use tool set
File based encryption (FBE)
Secure file system (SFS); fast trusted
Qualcomm® Trusted Execution Environment (TEE) v5.4 Widevine V16 L1, HDCP v2.3
ISDB-T, IP protection, camera security, trusted UI, DSP security, device attestation, connection security, trusted location, and RTIC |
| Boot sequence | 1. TME ROM FW+ Applications PBL
2. XBL
3. SHRM
4. AOP
5. HLOS
6. Rest of subsystems
Emergency boot over USB 3.1 |
| PLLs and clocks | ■ Multiple clock regimes; watchdog and sleep timers
■ Input: 19.2 MHz CXO
■ General purpose outputs: M/N counter and PDM |
| Debug | JTAG, design for software debug (DFSD), embedded USB debug (EUD), and ETM |
Chipset interface features |
| QLink | Three QLink0/1/2 ports for sub-6 and mmWave applications |
| Power management | 2-channel 2-line SPMI; plus other lines, as needed, via GPIOs, I2C
PM7325 + PM7350C + 3x PMG1110 + PMK7450 + PMR735A + 2x PM8010 |
Wireless connectivity WLAN
Bluetooth | PCIe interface SLIMbus/UART interface |
Fabrication technology and package |
| Digital die | 4 nm process |
| Non-PoP – small, thermally efficient package | 14.0 × 12.0 × 0.91 mm |
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发表于 2023-11-18 11:02
